At Lincstech, we are dedicated to providing values to our customers by working closely with them during New Product Development phase by providing professional technical service and ensuring time to market of their new products. We continue to develop our Printed Wiring Board (PWB) core manufacturing process and unique advanced technologies to contribute to the enhancement and differentiation of our customers products. We also work closely with PWB material on the latest material in the market and process vendors with the intention to improve our product and enhance quality.
Product Line Up
Multi-Layer Board (MLB)
Lincstech’s MLB technology enables the production of high-layer and high-density PWBs. Achieved through lamination, drilling, plating technologies, and precise simulation, these boards can have up to 50 layers and a thickness of up to 6.6mm. The combination of backdrilled stubless vias and high-frequency materials ensures excellent electrical performance.
High Density Interconnect Board (HDI)
Lincstech’s HDI boards feature advanced interconnection technology that allows for higher circuit density and miniaturization, making them ideal for compact and high-performance devices.
Advanced MLB / HDI Board
Combining the strengths of MLB and HDI technologies, Lincstech’s Advanced MLB/HDI Boards provide superior performance and reliability, meeting the demands of cutting-edge electronic products. These could include microvia technology, fine-line trace routing, and stacked microvias, enhancing signal integrity and reducing space requirements.
Module Board
Module boards play a pivotal role in various applications, from consumer electronics to industrial machinery. These boards are often customized for specific functions, combining different technologies (such as MLB, HDI, and embedded components) into a single module. Lincstech’s module boards contribute to the performance and reliability of complex systems.
