Combining the strengths of MLB and HDI technologies, our Advanced MLB/HDI Boards provide superior performance and reliability, meeting the demands of cutting-edge electronic products.
Features
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01Multi-Layer Construction
Supports multiple layers, providing extensive routing options and design flexibility.
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02Ultra-High Density
Offers exceptional circuit density, supporting highly complex and sophisticated designs.
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03Advanced Microvias
Utilizes advanced microvias, including blind and buried vias, for superior interconnectivity and space optimization.
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04Ultra-Low Loss /
High Speed MaterialsBuilt with latest Ultra-low loss and High Speed materials achieve excellent electrical performance. These materials reduce signal loss and improves transmission speed.
