Lincstech’s HDI boards feature advanced technology that allows for higher circuit density and miniaturization, making them ideal for compact and high-performance devices.
Features
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01Increased Layer Count
Capable of supporting multiple layers, allowing for intricate circuit designs.
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02High Circuit Density
Supports higher circuit density, allowing for more complex and compact designs.
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03High-Speed Materials
Lincstech selects high-speed materials to achieve excellent electrical performance. These materials reduces signal loss and improves transmission speed, ensuring reliable performance.
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04Backdrilled Controlled Stub Vias
Lincstech’s HDI boards utilize backdrilled stubless vias, which enhance electrical characteristics. These vias minimize signal reflections and enable reliable operation in high-frequency environments.
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05Microvias Technology
Utilizes microvias for efficient layer-to-layer connections, optimizing space and electrical performance.
